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Microelectronic Materials |
| Typical Applications |
Products |
-Die attach and encapusulation
-Thermal management
-Lid seal
-Underfill
-Wafer level packaging |
-Phase change
-One component epoxy
-Two components epoxy
-One component silicone
-Chip scale elastomers |
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Product |
Description |
Properties |
Viscosity
(cps)@25℃ |
Cure Schedule |
408-14 |
COB |
Fast curing，stable |
65K |
120℃ 10mins |
180-07 |
COB |
Low temp curing， Low cost |
30K |
120℃ 30mins |
400-58 |
Surface Mount adhesive |
Fast cure |
210k |
150℃ 5mins |
DA-5100 |
DIE-ATTACH silver epoxy |
High electric conductive、
good for IC Bonding |
Paste |
150℃ 30mins |
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For any enquiry, please contact us. Click Here for our contact information.
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