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Microelectronic Materials |
| Typical Applications |
Products |
-Die attach and encapusulation
-Thermal management
-Lid seal
-Underfill
-Wafer level packaging |
-Phase change
-One component epoxy
-Two components epoxy
-One component silicone
-Chip scale elastomers |
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Product |
Description |
Properties |
Viscosity
(cps)@25℃ |
Cure Schedule |
Color |
Density
@25℃ |
Temp. Range |
DA-5100 |
One component silver adhesive |
High electrical conductivity |
Paste |
150℃,30mins |
Silver |
3.42 |
- |
DA-5152 |
One component silver adhesive |
High electrical conductivity |
21.5K |
150℃,90mins |
Silver |
- |
-60-175℃ |
DA-5041 |
One component silver adhesive |
Fast cure |
8.5K |
150℃,10mins |
Silver |
3.90 |
- |
EN-5887 |
One component epoxy adhesive |
Transparent, Non-electrial, UV resistant |
3K |
150℃,45mins |
Transparent |
- |
-65-175℃ |
EN-7826 |
One component epoxy adhesive |
Low CTE |
95K |
150℃,30mins |
Black |
1.78 |
-60-175℃ |
400-97 |
One component epoxy adhesive |
Fast flow |
40K-60K |
125℃,60mins |
Black |
1.56 |
130℃ |
408-14 |
One component epoxy adhesive |
Low temperature curing |
65 K |
100℃,30mins |
Semi-Glossy Black |
1.49 |
- |
704-78 |
One component epoxy adhesive |
Fast cure |
25K |
120℃,10mins |
Black |
1.25 |
- |
UF-5001 |
One component Underfill |
Fast cure |
4K |
125℃,10mins |
Tan |
1.20 |
-60-175℃ |
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