Product

Description

Viscosity
CPS @ 30℃

Total Solids

Cure Schedule

Electrical Resistance
Ohms/Sq/Mil

CI-1001

Silver Polymer
Thick Film Ink

12,000

61%

10 Min. @230°F

<. 015

CI-1002

Silver Polymer Thick
Film Ink, Adhesion to ITO

7,000

64%

10 Min. @230°F

<. 035

CI-5001

Nickel Ink for
Membrane Switches

Thixotropic

56.5%

10 Min. @230°F

<5

DB-1501

One Component Stencil Print Conductive Adhesive

Paste

100%

<6 Min @285°F

0.0004 ohm-cm

DB-1502

Silver RFID Die
Attach Adhesive

10,000

100%

6 Min @300°F

<0. 200

DB-1504

Two Component Screen Printable Epoxy Adhesive

Thixotropic
Paste

91% (Mixed)

1-3 Min. @250-300°F

<. 020

CI-2001

Carbon Polymer
Thick Film Ink

Thixotropic

38%

10 Min. @230°F

<20.0

CI-2002

Carbon Ink
for ITO PET

Thixotropic

38%

10 Min. @230°F

<50.0

CI-4001

Ag/Ag Chloride for
Non-Polar Electrodes

12,000

74%

< 2 Min. @ 300°F

<0.500

DI-7001

Solvent Based
Protective Coating

Viscous Liquid

25%

10 Min. @230°F

>1,000 Mega ohms

DI-7502

UV Green
Curable Dielectric

10,000

100%

750 millijoules per
Square Centimeter

>1,000 Mega ohms

DI-7503

UV Blue
Curable Dielectric

10,000

100%

750 millijoules per
Square Centimeter

>1,000 Mega ohms

EC-9501

UV Encapsulant

15,000

100%

750 millijoules per
Square Centimeter

>100 Mega ohms

EC-9519

UV Curable
Encapsulant

4,000

100%

750 millijoulesper
Square Centimeter

>10 Mega ohms

EMI-1001

Conductive
EMI/RFI Coating

Sprayable

44%

Room Temp. for 5 Min.

<0.020