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Printed Circuit Board Materials |
| Typical Applications |
Products |
-Potting
-Coating
-Stencil/Screen printing
-Surface mount assembly
-Thermal management
-Encapsulants |
-One and two components epoxy systems
-Silicone and non silicone based heat sink compounds
-UV conformal coatings
-Electrically conductive inks (silver and carbon)
-Surface mount adhesive |
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Product |
Description |
Properties |
Viscosity (cps)@25℃ |
Cure Schedule |
Color |
Density
@25℃ |
Temp. Range |
286 A/B |
Two components epoxy adhesive |
1:1 |
Paste |
25℃,24hrs |
White |
A: 1.21 |
-55-150℃ |
B: 2.00 |
503-98 A/B |
Two components epoxy adhesive |
Fast curing |
A:1K-1.5K |
25℃,6mins |
Clear |
A/B:1.10 |
100℃ |
B:1.3K-1.8K |
802-18 A/B |
Two components silicone |
High thermal properties |
26.8K |
25℃,2-4hrs |
Black |
1.50 |
-70-215℃ |
400-58 |
Surface mount adhesive |
Strong adhesive strength |
880K |
120℃,2.5mins |
Red |
1.20 |
- |
380-01 UV |
UV cure |
Fast cure |
8K |
10secs |
Clear Water White |
1.16 |
-40-100℃ |
500-71-1 |
Coating |
UV traceable |
50-100 |
60-70℃,2hrs |
Green |
- |
20-100℃ |
503-62 |
Polymer thick film |
Low electrical resistance |
11K-13K |
110℃,10mins |
Silver |
- |
- |
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