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LED die attach adhesives |
| Typical Applications |
Products |
- Typical LED Lamp die attach
- High Power LED die attach
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- Silver epoxy adhesive
- High Thermal silver epoxy adhesive
- Reflow SMD type LED
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Product |
Description |
Thermal Conductivity |
Viscosity
(cps)@25¢J
|
Cure Schedule |
Color |
Density
@25¢J
|
Temp. Range |
| DA-5189-1 |
Low Power LED die attach |
2.0W/mK |
14,000 |
150C / 1hr |
Silver |
3.9 |
-40 to 150 |
| DA-5189-4 |
Low Power LED die attach |
2.0W/mK |
12,000 |
150C / 1hr |
Silver |
3.9 |
-40 to 150 |
| DA-5045 |
High Power LED die attach |
21W/mK |
10,500 |
150C / 1hr |
Silver |
5.8 |
-40 to 150 |
| DA-5045-2 |
High Power LED die attach |
21W/mK |
12,000 |
150C / 1hr |
Silver |
5.2 |
-40 to 150 |
DA-5045-3 |
3W LED die attach |
25W/mK |
11,500 |
150C / 1hr |
Silver |
5.5 |
-40 to 150 |
| DA-5045-4 |
High Power Reflow |
21W/mK |
10,000 |
150C / 1hr |
Silver |
5.25 |
-40 to 150 |
| DA-5887 |
Non-conductive optically clear |
0.2W/mK |
|
150C / 30mins |
Clear |
~1
|
-40 to 150 |
| DA-5887A/B |
2 component non-conductive die attach
4:3 mix ratio
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0.2W/mK |
7,000 |
150C / 30mins |
Clear |
~1 |
-40 to 150 |
| DA-5887-2 |
Non-conductive die attach |
0.8W/mK |
6,000 |
150C / 30mins |
Clear |
~1 |
-40 to 150 |
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